麻烦哪位大神帮我把下面资料翻译成英语电镀铜层因其具有良好的导电性、导热性和机械延展性等优点而被广泛应用于电子信息产品领域,电镀铜技术也因此渗透到了整个电子材料制造领域,

麻烦哪位大神帮我把下面资料翻译成英语电镀铜层因其具有良好的导电性、导热性和机械延展性等优点而被广泛应用于电子信息产品领域,电镀铜技术也因此渗透到了整个电子材料制造领域,
麻烦哪位大神帮我把下面资料翻译成英语
电镀铜层因其具有良好的导电性、导热性和机械延展性等优点而被广泛应用于电子信息产品领域,电镀铜技术也因此渗透到了整个电子材料制造领域,从印制电路板（PCB）制造到 IC 封装,再到大规模集成线路（芯片）的铜互连技术等电子领域都离不开它,因此电镀铜技术已成为现代微电子制造中必不可少的关键电镀技术之一.电子行业的电镀铜技术含量很高.
随着电镀铜技术的发展,电镀废液产生的危害也成了一个当今社会无法避免的问题：资源的浪费以及环境的破坏,这些问题将是对电镀技术的一个新的挑战.因此,对于电镀铜废水的合理处理成了一个刻不容缓的研究课题
在印制线路板生产过程中,电镀铜工艺是必不可少的一个环节,由此产生的镀铜废液量不仅很大,而且含有大量的重金属铜（一般为20 g/L ~ 30 g/L）和添加剂.常规处理技术主要有化学沉淀法、氧化还原法、离子交换法、电解法等.
在此,我们通过电解得方法来合理的处理电镀铜废液.具体电镀过程中,温度、镀液的pH值、电流密度、极板间距、施镀时间等因素都会对镀层质量有一定影响.
研究表明,通过一系列的对比实验可以得知,在电镀铜实验中,采用石墨电极作为阳极,铜片作为阴极,在25℃下,电流密度为0.50 A/dm2 条件下,电镀液的pH值分别为1.5,极板间距分别为1.5cm,可以大大提升电镀的效率.
研究表明,通过电镀,得到电镀铜时阴极发生析氢腐蚀的镀液浓度为0.08mol/L
关键词 电镀铜废液 电解 影响因素 析氢腐蚀

麻烦哪位大神帮我把下面资料翻译成英语电镀铜层因其具有良好的导电性、导热性和机械延展性等优点而被广泛应用于电子信息产品领域,电镀铜技术也因此渗透到了整个电子材料制造领域,
Copper plating layer because of its good electrical conductivity, thermal conductivity and mechanical ductility has been widely used in electronic and information products in the field, copper plating technology has also penetrated into the field of electronic materials manufacturing, from the printed circuit board ( PCB ) manufacturing to the IC package, and then to the large scale integrated circuit ( chip ). Copper interconnect technology and other electronic fields are inseparable from it, so the copper plating technology has become a modern microelectronics manufacturing essential electroplating technology of. The electronics industry with very high content of copper plating technology.
With the development of copper plating technology, electroplating waste water hazards has become a modern society can not avoid the problem: the waste of resources and environmental destruction, these issues will be on the electroplating technology of a new challenge. Therefore, for copper electroplating wastewater processing into a crunch time research
In the production process of the printed circuit board, copper plating process is an indispensable link, the resulting copper waste liquid quantity not only, and contains a large number of heavy metal (typically 20g/L ~30 g/L ) and additives. Conventional processing techniques mainly include chemical precipitation, oxidation reduction method, ion exchange method, electrolytic method.
Here, we by electrolytic methods to the reasonable processing copper electroplating waste liquor. The electroplating process plating solution, temperature, pH value, current density, plate spacing, plating time and other factors will have a certain impact on the quality of coating.
Research shows that, through a series of experiments can be informed, in copper plating experiments, using graphite electrode as the anode, cathode copper as, at 25 ℃, the current density is 0.50 A/dm2, electroplating solution of pH = 1.5, the plate distance were 1.5cm, can greatly improve the efficiency of plating.
Research shows that, by electroplating, plating copper cathode by occurrence of hydrogen corrosion bath concentration is 0.08mol/L
Keywords copper electroplating waste water electrolysis hydrogen corrosion influence factors