英语翻译1、单次切割加工时,根据加工表面光度要求,脉宽一般为5 80us,脉间一般为脉宽的5倍,脉宽加大可以提高加工速度,但表面粗糙度会增加,减速小脉间,一般不影响加工表面的光洁度,可以提

英语翻译1、单次切割加工时,根据加工表面光度要求,脉宽一般为5 80us,脉间一般为脉宽的5倍,脉宽加大可以提高加工速度,但表面粗糙度会增加,减速小脉间,一般不影响加工表面的光洁度,可以提
英语翻译
1、单次切割加工时,根据加工表面光度要求,脉宽一般为5 80us,脉间一般为脉宽的5倍,脉宽加大可以提高加工速度,但表面粗糙度会增加,减速小脉间,一般不影响加工表面的光洁度,可以提高加工效率,但是过小的脉间,会使加工不稳定,严重时会烧断钼丝；对于大厚度工件或是难加工的工件一般采用大脉宽（60-80us）与大脉间(脉宽的7-10倍),短路电流为45以上,平均加工电流一般不大于3.0A.
2、加工电压一般采用1H,当加工大厚度工件及导电性不好的材料用2H或是改变变压器上的接线,采用更高的加工电压进行加工.
3、多次切割一般采用三次切割即可,第1次的偏移量一般为0.05~0.08mm,第2次的偏移量一般为0.005~0.015mm,最后一次必需为0mm.
4、采用前阶梯波可以降低钼丝损耗,一般选用B、C、D档.
就只有25分

英语翻译1、单次切割加工时,根据加工表面光度要求,脉宽一般为5 80us,脉间一般为脉宽的5倍,脉宽加大可以提高加工速度,但表面粗糙度会增加,减速小脉间,一般不影响加工表面的光洁度,可以提
1,single cutting processing,according to machining surface photometric requirements,pulse width is commonly 5 80us,interveinal general for pulse width 5 times,pulse width increasing can improve the processing speed,but the surface roughness increases,slowing small interveinal generally do not affect machining surface finish,can increase the processing efficiency,but too small interveinal,can make the processing is not stable,severe burn when cut molybdenum wire; For large thickness or difficult-to-machine artifacts of the workpiece generally adopted pulse width (60 - big 80us) and big interveinal (pulse width 7 to 10 times),short-circuit current 45 above,average processing current general no greater than 3.0 A.
2,processing voltage generally USES 1H,when processing large thickness workpiece and conductivity bad material to use 2H or change of the connection,the transformer higher machining voltage for machining.
3,multiple cutting generally USES three times,the first time cutting can offset generally is 0.05 0.08 mm,second offset is commonly 0.005 0.015 mm,for the last time 0mm necessary.
4,the previous ladder wave can reduce molybdenum wire losses,the general selection B,C,D gear.